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Ogłoszenie zamieszczone 06.12.2019, w kategorii Praca

Embedded Firmware Developer for LTE Physical Layer

Project information:
Industry: Digital Product Engineering Services
Location: Wrocław
Working hours: flexible
Form of employment: B2B or regular employment contract
Project length: indefinite
Assignment starts: ASAP
Remuneration: PLN 14 000 - 19 500 goss on Employment Contract, PLN 100 - 130 net/h on B2B
Requirements:
Good understanding of embedded architectures (VSPA knowledge is a plus but not mandatory)
Understanding of 3GPP LTE L1/PHY standards (know how about L2 is a plus)
Understanding of Matlab programming (recommended but not mandatory)
Good C and/or asm know-how
We offer:
Stable long-term cooperation
Challenging work in a dynamic international environment and great potential for development
Possibility to taking part in a professional trainings
Private medical care (Signal Iduna)
Multisport card
Responsibilities:
Developing LTE/WiFi L1/PHY C-code for NXP VSPA3 DSP - new features requested for product
Code size optimization
Code performance optimization (real time)
Code reviews/KPIs matching
Integration of new features to platform
Reference testing with existing Matlab code
Working in multi-site project (Romania, Poland, USA)

lokalizacja: Wrocław
www: http://aplikuj.hrlink.pl/ap...

Ogłoszenie przeczytano 56 razy. Data wygaśnięcia: 05.01.2020

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